• Higher power handling capacity. The thermal limit is effectively reduced, allowing the voice coil to work 80ºC below comparing to our previous thermal circuit.
  • Reduced power compression losses, which allows to keep the final SPL (Sound Pressure Level) in more constant values within a working period.
  • More stable and linear behaviour of the moving assembly in long excursions thanks to the new system design, reducing offset issues commonly related to asymmetries in non-linear components (mainly Bl(x), L(x) and Kms(x)).
  • Dynamic response. The efficiency of the HELICEX® system allows to use 5” or 4” voice coil diameter (depending on model), which means lower Mms values and better control of the moving assembly compared to other systems and comparable products available nowadays, as well as lower overall weights of the speaker because of an optimized dimensioning of the mechanical assembly.

 

 

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